The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Mar. 28, 2006
Hirotoshi Kubo, Gunma, JP;
Yukari Shirahata, Aichi, JP;
Shigehito Matsumoto, Saitama, JP;
Masamichi Yamamuro, Tochigi, JP;
Koujiro Kameyama, Gunma, JP;
Mitsuo Umemoto, Gunma, JP;
Hirotoshi Kubo, Gunma, JP;
Yukari Shirahata, Aichi, JP;
Shigehito Matsumoto, Saitama, JP;
Masamichi Yamamuro, Tochigi, JP;
Koujiro Kameyama, Gunma, JP;
Mitsuo Umemoto, Gunma, JP;
Sanyo Electric Co., Ltd., Moriguchi-shi, Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Ora-gun, Gunma, JP;
Abstract
Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Moreover, the emitter pad electrodes connected to a grounding potential are connected to the backside electrode through feedthrough electrodes penetrating the semiconductor substrate in a thickness direction.