The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2008

Filed:

Feb. 09, 2001
Applicants:

Wolfgang Ehrfeld, Mainz, DE;

Peter Westphal, Jena, DE;

Bernd Limburg, Essenheim, DE;

Antje Pommereau, Otterberg, DE;

Svend Berger, Mainz, DE;

Inventors:

Wolfgang Ehrfeld, Mainz, DE;

Peter Westphal, Jena, DE;

Bernd Limburg, Essenheim, DE;

Antje Pommereau, Otterberg, DE;

Svend Berger, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/17 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method for quantitatively and/or qualitatively detecting layer thicknesses of biological or chemical molecules by means of ellipsometric measurements. Said molecules are deposited on at least one metal layer by virtue of interactions with a gaseous or liquid medium, whereby said metal layer is provided with an immobilisation layer. A method that can be carried out quickly is provided by including the surface plasmon resonance. Said method is provided with a significantly greater detection sensitivity and can be used not only for qualitatively detecting layers. According to the inventive method, the angle of incidence and/or the frequency of the electromagnetic radiation which is used for the ellipsometric measurements is/are adjusted in such a way that a surface plasmon resonance is produced in the metal layer. The detection sensitivity (δ cos Δ)/(thickness of the layer to be detected) is adjusted by means of the thickness of the metal layer.


Find Patent Forward Citations

Loading…