The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Nov. 19, 2004
Evan George Colgan, Chestnut Ridge, NY (US);
Gary Goth, Pleasant Valley, NY (US);
Deborah Anne Sylvester, Poughkeepsie, NY (US);
Jeffrey Allen Zitz, Poughkeepsie, NY (US);
Evan George Colgan, Chestnut Ridge, NY (US);
Gary Goth, Pleasant Valley, NY (US);
Deborah Anne Sylvester, Poughkeepsie, NY (US);
Jeffrey Allen Zitz, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.