The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Jul. 25, 2006
Ming-yen Chiu, Ping-Tung Hsien, TW;
Ming-Yen Chiu, Ping-Tung Hsien, TW;
Touch Micro-System Technology Inc., Yang-Mei, Taoyuan Hsien, TW;
Abstract
A method of fabricating microconnectors. A wafer is provided, and a dielectric layer is formed on a first surface of the wafer. The dielectric layer is bonded to a support wafer, and a thinning process is performed. A second surface of the wafer is then bonded to the support wafer, and a conductive wiring pattern is formed on the dielectric layer. An insulating layer is formed on the dielectric layer and the conductive wiring pattern. A portion of the insulating layer is removed to expose the conductive wiring pattern, and a portion of the dielectric layer and the wafer is removed to divide the wafer into a plurality of microconnectors.