The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2008

Filed:

Apr. 18, 2005
Applicant:

Daisuke Abe, Suwa, JP;

Inventor:

Daisuke Abe, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

Aspects of the invention provide a method, in a semiconductor device, such as a thin film transistor, a technology capable of preventing or reducing the electric field concentration at the edge section of the semiconductor film to enhance the reliability. The method of manufacturing a semiconductor device according to the invention can include a first step of forming a semiconductor film discretely on an insulation substrate, a second step of covering the semiconductor film including an edge section of the semiconductor film with a first insulation film, a third step of opening the first insulation film above the semiconductor film excluding the edge section of the semiconductor film, a fourth step of forming a second insulation film thinner than the first insulation film on the semiconductor film corresponding to at least the opening of the first insulation film, and a fifth step of forming an electrode wiring film on the second insulation film.


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