The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Jan. 27, 2005
Shao-chien Lee, Taoyuan County, TW;
Tzyy Jang Tseng, Hsinchu, TW;
Chang-ming Lee, Taoyuan County, TW;
Shao-Chien Lee, Taoyuan County, TW;
Tzyy Jang Tseng, Hsinchu, TW;
Chang-Ming Lee, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A method for fabricating an electrical interconnect structure is adapted for a circuit board manufacturing process. The circuit board comprises a conductive substrate, which comprises a first conductive layer and a bump conductive layer. The bump conductive layer is patterned to form at least one bump over the first conductive layer. Then, a dielectric layer is formed over the first conductive layer and the bump. A second conductive layer is formed over the dielectric layer. At least one blind hole is formed in the second conductive layer and the dielectric layer, passing through the second conductive layer and the dielectric layer to expose the top surface of the bump. A conductive material is filled in the blind hole, and the conductive material in the blind hole and the bump constitute a conductive post.