The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
May. 16, 2005
Renhe Jia, Berkeley, CA (US);
Feng Q. Liu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Renhe Jia, Berkeley, CA (US);
Feng Q. Liu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. Polishing compositions are provided for removing at least a barrier material from a substrate surface by a chemical mechanical polishing process or by an electrochemical mechanical polishing process. The polishing compositions used in barrier removal may further be used after a process for electrochemical mechanical planarization process of a conductive material. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization type defects.