The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Mar. 24, 2006
Toshinobu Banjo, Kyoto, JP;
Shigeru Hirata, Kyoto, JP;
Masanori Shirasawa, Kyoto, JP;
Towa Corporation, Kyoto, JP;
Abstract
A resin molding apparatus includes a fixing member to which a top mold is attached, a movable member to which a bottom mold is attached, a push-up member provided below the movable member, a drive mechanism moving the push-up member in upward/downward direction, and a flexible joint provided between the movable member and the push-up member. The push-up force of the drive mechanism is transmitted from the push-up member via the flexible joint to the movable member. Thus, a crack does not occur at a connection portion between the push-up member and the movable member. Therefore, a gap is not created between the top mold and the bottom mold. As a result, an excellent molded product is formed.