The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
May. 07, 2003
Kevin E. Cooper, La Terrasse, FR;
John C. Flake, Montbonnot, FR;
Johannes Groschopf, Wainsdorf, DE;
Yuri E. Solomentsev, Allen, TX (US);
Kevin E. Cooper, La Terrasse, FR;
John C. Flake, Montbonnot, FR;
Johannes Groschopf, Wainsdorf, DE;
Yuri E. Solomentsev, Allen, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method for processing semiconductor wafers is disclosed. A semiconductor wafer is provided to a semiconductor processing stage where a block copolymer surfactant (BCS) is applied to the wafer surface. In one embodiment, the BCS includes a hydrophobic portion and a hydrophilic portion. Alternatively, the BCS may be a silicone-containing BCS. In one embodiment, the BCS is within an aqueous solution where the concentration of the BCS within the aqueous solution is less than one percent by weight. Also disclosed is an aqueous solution including abrasive particles and a BCS having a hydrophobic portion and a hydrophilic portion. The abrasive particles may include silica, alumina, or ceria.