Batch photoresist dry strip and ash system and process

Abstract

Photoresist stripping is provided that employs batch processing to maximize throughput and an upstream plasma activation source using vapor or gas processing to efficiently create reactive species and minimize chemical consumption. An upstream plasma activation source efficiently creates reactive species remote from the photoresist on the substrate surfaces. Either a remote plasma generator upstream of the processing chamber or an integrated plasma unit within the processing chamber upstream of the processing volume may be used. Plasma processing gas is introduced from a side of a stack of wafers and flows across the wafers. Processing gas may be forced across the surfaces of the wafers in the column to an exhaust on the opposite side of the column, and the column may be rotated. An upstream plasma activation source enables a strip process to occur at low temperatures, for example below 600 degrees C., which are particularly advantageous in BEOL process flow. Integrated processes that combine dry and wet-like sequential processes are also provided. Oxidizing, reducing or fluorine-containing plasma can be employed. Wet stripping, using, for example, wafer vapor or ozone or both may be included, simultaneously or sequentially.