Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof

Abstract

The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plateis bonded on a part of a ceramic substrateso as to expose an outer peripheral edge portion of the ceramic substratein an integrally bonded member, the integrally bonded memberis set on a treating apparatuswhile being covered with a masking memberhaving a window portionfrom which the circuit pattern forming metal plateof the integrally bonded memberis exposed. Further, the integrally bonded memberis pressed with an appropriate pressure from a base plateside so that a boundary surface between a portionsurrounding the window portion in the masking member and an exposed surfaceof the ceramic substrate which is exposed in a metal-ceramic bonded memberhas a state not allowing a liquid to pass therethrough. Thereafter, a treatment solutionfor wet treatment is injected from an injection pipeto be in contact with the circuit pattern forming metal plate