The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2008

Filed:

Nov. 06, 2006
Applicants:

J. Devin Mackenzie, San Mateo, CA (US);

James Montague Cleeves, Redwood City, CA (US);

Vik Pavate, San Mateo, CA (US);

Christopher Gudeman, Los Gatos, CA (US);

Fabio Zurcher, Brisbane, CA (US);

Max Davis, San Francisco, CA (US);

Dan Good, San Francisco, CA (US);

Joerg Rockenberger, Redwood City, CA (US);

Inventors:

J. Devin MacKenzie, San Mateo, CA (US);

James Montague Cleeves, Redwood City, CA (US);

Vik Pavate, San Mateo, CA (US);

Christopher Gudeman, Los Gatos, CA (US);

Fabio Zurcher, Brisbane, CA (US);

Max Davis, San Francisco, CA (US);

Dan Good, San Francisco, CA (US);

Joerg Rockenberger, Redwood City, CA (US);

Assignee:

Kovio, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A RF MOS- or nonlinear device-based surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes (a) an inductor, (b) a first capacitor plate coupled to the inductor, (c) a dielectric film on the first capacitor plate, (d) a semiconductor component on the dielectric film, and (e) a conductor that provides electrical communication between the semiconductor component and the inductor. The method of manufacture generally includes (1) depositing a semiconductor material (or precursor) on a dielectric film; (2) forming a semiconductor component from the semiconductor material/precursor; (3) forming a conductive structure at least partly on the semiconductor component; and (4) etching the electrically functional substrate to form (i) an inductor and/or (ii) a second capacitor plate. The method of use generally includes (i) causing/inducing a current in the present tag sufficient for it to generate detectable electromagnetic radiation; (ii) detecting the radiation; and optionally, (iii) selectively deactivating the tag. The present invention advantageously provides a low cost EAS/RFID tag capable of operating at MHz frequencies and in frequency division and/or frequency multiplication modes.


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