The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
May. 25, 2005
Applicants:
Salman Akram, Boise, ID (US);
Derek J. Gochnour, Boise, ID (US);
Michael E. Hess, Kuna, ID (US);
David R. Hembree, Boise, ID (US);
Inventors:
Salman Akram, Boise, ID (US);
Derek J. Gochnour, Boise, ID (US);
Michael E. Hess, Kuna, ID (US);
David R. Hembree, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/32 (2006.01);
U.S. Cl.
CPC ...
Abstract
A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.