The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Mar. 21, 2003
Heinrich Meyer, Berlin, DE;
Konrad Crämer, Berlin, DE;
Olaf Kurtz, Berlin, DE;
Ralph Herber, Berlin, DE;
Wolfgang Friz, Berlin, DE;
Carsten Schwiekendick, Berlin, DE;
Oliver Ringtunatus, Berlin, DE;
Christian Madry, Berlin, DE;
Heinrich Meyer, Berlin, DE;
Konrad Crämer, Berlin, DE;
Olaf Kurtz, Berlin, DE;
Ralph Herber, Berlin, DE;
Wolfgang Friz, Berlin, DE;
Carsten Schwiekendick, Berlin, DE;
Oliver Ringtunatus, Berlin, DE;
Christian Madry, Berlin, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.