The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2008

Filed:

Mar. 19, 2001
Applicants:

Masahiko Kakizawa, Saitama, JP;

Mayumi Kimura, Saitama, JP;

Hironori Mizuta, Saitama, JP;

Ichiro Hayashida, Saitama, JP;

Inventors:

Masahiko Kakizawa, Saitama, JP;

Mayumi Kimura, Saitama, JP;

Hironori Mizuta, Saitama, JP;

Ichiro Hayashida, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor surface cleaning agent containing a compound the molecule of which has a nitrogen atom having an unshared electron pair and used for cleaning the surface of a semiconductor on which copper wiring is provided, and a method for cleaning the surface of a semiconductor characterized by treating the surface of a semiconductor on which copper wiring is provided with such a cleaning agent. The cleaning agent does not corrode the copper wiring (copper thin film) on the semiconductor and SiOof the interlayer insulating film, does not impair the flatness of the surface, and is effective in removing CuO and particles adhering to the surface of the Cu-CMP step.


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