The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Aug. 20, 2004
Koya Kikuchi, Kawabe, JP;
Noriou Shimada, Yuwa, JP;
Keiyo Kusanagi, Akita, JP;
Akihiko Hatasawa, Akita, JP;
Yutaka Kagaya, Hachimori, JP;
Koya Kikuchi, Kawabe, JP;
Noriou Shimada, Yuwa, JP;
Keiyo Kusanagi, Akita, JP;
Akihiko Hatasawa, Akita, JP;
Yutaka Kagaya, Hachimori, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a plurality of electrodes on a main surface thereof, being connected with the leads extending into the device hole; an encapsulant formed of an insulating resin, the leads and a predetermined portion of the tape; bump electrodes provided on one surface of the leads; slits provided in the tape between the encapsulant and the bump electrodes and extending along a column of the bump electrodes; and a warp prevention reinforcement made of an insulating film and formed over the tape; wherein the semiconductor chip and the bump electrodes are connected to one and the same surface side of the leads.