The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Mar. 13, 2002
Yukihiko Toyoda, Gifu, JP;
Yoichiro Kawamura, Gifu, JP;
Tomoyuki Ikeda, Gifu, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A multilayered printed circuit board includes a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition. The conductor circuits between which the interlaminar resin insulating layer is sandwiched are connected by a via-hole. The via-hole includes at least one of Cu, Ni, Pd, Co, W and their alloys. Via-holes in different level layers among the via-holes are formed so as to form the stack-via structure. At least one of the land diameters of the via-holes in different level layers is different from the land diameters of other via-holes in different level layers.