The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Jul. 03, 2003
Toshiro Hiraoka, Kanagawa-Ken, JP;
Mitsuyoshi Endo, Kanagawa-Ken, JP;
Naoko Yamaguchi, Kanagawa-Ken, JP;
Yasuyuki Hotta, Tokyo, JP;
Shigeru Matake, Kanagawa-Ken, JP;
Hideo Aoki, Kanagawa-Ken, JP;
Misa Sawanobori, Kanagawa-Ken, JP;
Toshiro Hiraoka, Kanagawa-Ken, JP;
Mitsuyoshi Endo, Kanagawa-Ken, JP;
Naoko Yamaguchi, Kanagawa-Ken, JP;
Yasuyuki Hotta, Tokyo, JP;
Shigeru Matake, Kanagawa-Ken, JP;
Hideo Aoki, Kanagawa-Ken, JP;
Misa Sawanobori, Kanagawa-Ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.