The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Jun. 30, 2004
Anna M. George, Legal Representative, Sunnyvale, CA (US);
Anna M. George, legal representative, Sunnyvale, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus comprising a substrate comprising a base substrate, a conductive layer on the base substrate, and a solder resist layer on the conductive layer, a die including an optical area, the die being flip-chip bonded to the substrate, and an optical inter-connector optically coupled to the optical area and at least partially positioned between the die and the base substrate, the optical inter-connector positioned in a trench formed in the solder resist layer and the conductive layer. A process comprising providing a substrate comprising a base substrate, a conductive layer on the base substrate, and a solder resist layer on the conductive layer, forming a trench in the conductive layer and the solder resist layer, positioning a waveguide in the trench, and flip-chip bonding a die to the substrate, the die including an optical area, such that the optical area is optically coupled to the waveguide.