The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2008

Filed:

Jan. 17, 2003
Applicants:

Toshio Narita, Hokkaido, JP;

Shigenari Hayashi, Hokkaido, JP;

Takayuki Yoshioka, Kanagawa, JP;

Hiroshi Yakuwa, Kanagawa, JP;

Michiaki Souma, Hokkaido, JP;

Michihisa Fukumoto, Akita, JP;

Inventors:

Toshio Narita, Hokkaido, JP;

Shigenari Hayashi, Hokkaido, JP;

Takayuki Yoshioka, Kanagawa, JP;

Hiroshi Yakuwa, Kanagawa, JP;

Michiaki Souma, Hokkaido, JP;

Michihisa Fukumoto, Akita, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method for forming a high-Re-content alloy film, such as a Re-based film containing Re at 98% or more by atomic composition, or an alloy film containing Re in the range of 65 to less than 98% by atomic composition and at least one of Ni, Fe and Co. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion, at least one ion selected from the group consisting of Ni, Fe, Co and Cr ions, and at least one of a Li ion and a Na ion. The present invention allows a high-Re-content alloy film usable as a corrosion-resistant alloy coating for a high-temperature component or the like to be formed through an electroplating process using an aqueous solution, so as to provide heat/corrosion resistances to the component, even if it has a complicated shape, in a simplified manner at a low cost.


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