The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Jan. 27, 2005
Philippe M. Vereecken, Sleepy Hollow, NY (US);
Veeraraghavan S. Basker, Yorktown Heights, NY (US);
Cyril Cabral, Jr., Mahopac, NY (US);
Emanuel I. Cooper, Scarsdale, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Martin M. Frank, New York, NY (US);
Rajarao Jammy, Hopewell Junction, NY (US);
Vamsi Krishna Paruchuri, New York, NY (US);
Katherine L. Saenger, Ossining, NY (US);
Xiaoyan Shao, Yorktown Heights, NY (US);
Philippe M. Vereecken, Sleepy Hollow, NY (US);
Veeraraghavan S. Basker, Yorktown Heights, NY (US);
Cyril Cabral, Jr., Mahopac, NY (US);
Emanuel I. Cooper, Scarsdale, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Martin M. Frank, New York, NY (US);
Rajarao Jammy, Hopewell Junction, NY (US);
Vamsi Krishna Paruchuri, New York, NY (US);
Katherine L. Saenger, Ossining, NY (US);
Xiaoyan Shao, Yorktown Heights, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate, dielectric layer, and electrolyte solution or melt, wherein the combination of the substrate, dielectric layer, and electrolyte solution or melt allow an electrochemical current to be passed from the substrate through the dielectric layer into the electrolyte solution or melt. Methods are also provided for electrochemical modification of dielectrics utilizing through-dielectric current flow.