The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Oct. 05, 2005
Applicants:
Takeshi Kawabata, Osaka, JP;
Motoaki Satou, Kyoto, JP;
Toshiyuki Fukuda, Kyoto, JP;
Toshio Tsuda, Osaka, JP;
Kazuhiro Nobori, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Inventors:
Takeshi Kawabata, Osaka, JP;
Motoaki Satou, Kyoto, JP;
Toshiyuki Fukuda, Kyoto, JP;
Toshio Tsuda, Osaka, JP;
Kazuhiro Nobori, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module is formed by alternately stacking resin boardson which semiconductor chipsare mounted and sheet members having openings larger than the semiconductor chipsand bonded to the resin boards. The resin boardlocated at the bottom out of the resin boardsis thicker than the other resin boards