The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7365410 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 29, 2008

Filed:

Oct. 29, 2004
Applicants:

Alexander A. Demkov, Austin, TX (US);

William J. Taylor, Jr., Round Rock, TX (US);

Inventors:

Alexander A. Demkov, Austin, TX (US);

William J. Taylor, Jr., Round Rock, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/12 (2006.01); H01L 29/16 (2006.01); H01L 29/161 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a semiconductor structure including providing a semiconductor substrate, forming a metallic buffer layer over the semiconductor substrate, forming an amorphous semiconductor layer over the metallic buffer layer, and recrystallizing the amorphous semiconductor layer to form a crystalline semiconductor layer. A semiconductor structure includes a semiconductor substrate, a buffer layer comprising at least one of silicide and germanide formed over the semiconductor substrate, and a crystalline semiconductor layer formed over the metallic buffer layer.


Find Patent Forward Citations

Demkov, Alexander. (2008). Semiconductor structure having a metallic buffer layer and method for forming (U.S. Patent No. 7365410). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7365410

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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