The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Aug. 19, 2005
Ryosuke Usui, Aichi, JP;
Hideki Mizuhara, Aichi, JP;
Yusuke Igarashi, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Ryosuke Usui, Aichi, JP;
Hideki Mizuhara, Aichi, JP;
Yusuke Igarashi, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto SANYO Semiconductors Co., Ltd., Gunma, JP;
Abstract
A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto the overcoat resin. A first conductive filmA and a second conductive filmB, which are laminated with an interlayer insulating layerinterposed in between, are formed. By selectively removing the first conductive film, a first conductive wiring layerA is formed and the first conductive wiring layer is covered with an overcoat resin. Overcoat resinis irradiated with plasma to roughen its top surface. A sealing resin layeris formed so as to cover the top surface of the roughened overcoat resinand circuit elements