The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2008

Filed:

Nov. 01, 2002
Applicants:

Keizo Hirose, Nirasaki, JP;

Kenji Sekiguchi, Nirasaki, JP;

Inventors:

Keizo Hirose, Nirasaki, JP;

Kenji Sekiguchi, Nirasaki, JP;

Assignee:

Tokyo Electron Limited, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzlerebounds from a cup CP and scatters in the form of mist toward the center side of a wafer W, a rinsing liquid is supplied from a rinse nozzleto form a water filmon the wafer W. Owing to the presence of the water film, the surface of the wafer W is protected from adhesion of particles contained in the mist. It is possible to prevent the particles in the mist from adhering to the wafer W and also possible to prevent a bad influence on the wafer W.


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