The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Sep. 17, 2004
Pai-chou Liu, Kaohsiung, TW;
Hsin-fu Chuang, Ciaotou Township, Kaohsiung County, TW;
Pai-Chou Liu, Kaohsiung, TW;
Hsin-Fu Chuang, Ciaotou Township, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed side, a second exposed side and a center between the exposed sides. A plurality of first pre-solders and second pre-solders are formed on the surface to cover the first and second exposed sides of the contact pads respectively, the centers of the contact pads between the first and second pre-solders being exposed. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals are connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the centers of the contact pad to prevent the fine pitch contact pads from bridging.