The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
May. 15, 2003
Junpei Kusukawa, Hitachinaka, JP;
Ryozo Takeuchi, Hitachi, JP;
Junpei Kusukawa, Hitachinaka, JP;
Ryozo Takeuchi, Hitachi, JP;
Renesas Technology Corporation, Tokyo, JP;
Abstract
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion migration even in high temperatures and highly humid environments. The printed wiring board has a circuit comprising a metal conductor on base metal layers created by forming an insulating resin layeron at least one face of an insulating substrateand forming the base metal layersandon the insulating resin layer. In the printed wiring board, at least a part of an upper face of the insulating resin layer existing in spacesbetween the metal conductors is formed at a position lower than the interface between the base metal layerand the insulating resin layer