The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Dec. 05, 2005
Ryuichi Handa, Annaka, JP;
Akio Nakano, Annaka, JP;
Ryuichi Handa, Annaka, JP;
Akio Nakano, Annaka, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
Provided is an electrostatic chuck, including: a first insulating layer including a heat conductive silicone rubber with a thermal conductivity of at least 0.2 W/mK, which is formed on top of a metal substrate, either directly or with an adhesive layer disposed therebetween; a conductive pattern, which is formed on top of the first insulating layer, either directly or with an adhesive layer disposed therebetween; a second insulating layer including an insulating polyimide film, which is formed on top of the conductive pattern, either directly or with an adhesive layer disposed therebetween; and a third insulating layer including a heat conductive silicone rubber with a thermal conductivity of at least 0.2 W/mK, a hardness of no more than 85, and a surface roughness of no more than 5 μm, which is formed on top of the second insulating layer, either directly or with an adhesive layer disposed therebetween. Also provided is a process for holding a substrate on the electrostatic chuck. The electrostatic chuck exhibits excellent cooling performance and insulation performance, and is ideal for holding a substrate during the production of a semiconductor integrated circuit.