The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Oct. 13, 2004
Applicant:
Sung-mao Wu, Kaohsiung, TW;
Inventor:
Sung-Mao Wu, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/425 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package structure with a microstrip antenna comprises a packaging substrate, a chip and a microstrip radiation device. The packaging substrate has an upper surface having a packaging area on which the chip is disposed and a peripheral area on which the microstrip radiation device is disposed for transceiving a signal of the chip.
Quick Actions:
Wu, Sung-Mao. (2008). Semiconductor package structure with microstrip antennan (U.S. Patent No. 7352056). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7352056
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