The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Apr. 13, 2006
Hideki Yabe, Tokyo, JP;
Yuichi Sakai, Tokyo, JP;
Yoshitatsu Kawama, Tokyo, JP;
Munehito Kumagai, Tokyo, JP;
Yasuyuki Nakaoka, Tokyo, JP;
Hideki Yabe, Tokyo, JP;
Yuichi Sakai, Tokyo, JP;
Yoshitatsu Kawama, Tokyo, JP;
Munehito Kumagai, Tokyo, JP;
Yasuyuki Nakaoka, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile