The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Feb. 17, 2006
Naoko Yamaguchi, Yokohama, JP;
Hideo Aoki, Yokohama, JP;
Naoko Yamaguchi, Yokohama, JP;
Hideo Aoki, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece having the plating foundation layer in the portion where the punch is inserted. A second plating foundation layer is formed by printing on a rear face of the sheet-shaped insulating substrate. A first and second wiring layers composed of a metal plating layer are formed by performing electroless plating, and at the same time, a metal plating layer connecting between the first and second wiring layers is formed in the through hole using the plating foundation layer on the piece.