The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Sep. 13, 2005
Stefano Schiaffino, Pleasanton, CA (US);
Ashim Shatil Haque, San Jose, CA (US);
Paul S. Martin, Pleasanton, CA (US);
Daniel A. Steigerwald, Cupertino, CA (US);
Decai Sun, Los Altos, CA (US);
Stefano Schiaffino, Pleasanton, CA (US);
Ashim Shatil Haque, San Jose, CA (US);
Paul S. Martin, Pleasanton, CA (US);
Daniel A. Steigerwald, Cupertino, CA (US);
Decai Sun, Los Altos, CA (US);
Philips Lumileds Lighting Company LLC, San Jose, CA (US);
Abstract
A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer formed on the mount or a metal layer formed on one of the contacts. The plated metal layer may replace other known interconnecting techniques such as stud bumps. The semiconductor light emitting device is physically connected to the mount by causing interdiffusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.