The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Jun. 02, 2003
Robert L. Borwick, Iii, Thousand Oaks, CA (US);
Philip A. Stupar, Oxnard, CA (US);
Jeffrey F. Denatale, Thousand Oaks, CA (US);
Jun J. Yao, San Diego, CA (US);
Sangtae Park, Sugar Land, TX (US);
Robert L. Borwick, III, Thousand Oaks, CA (US);
Philip A. Stupar, Oxnard, CA (US);
Jeffrey F. DeNatale, Thousand Oaks, CA (US);
Jun J. Yao, San Diego, CA (US);
Sangtae Park, Sugar Land, TX (US);
Teledyne Licensing, LLC, Thousand Oaks, CA (US);
Abstract
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.