The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Sep. 30, 2004
Daniel Charles Kerr, Orlando, FL (US);
Alan Sangone Chen, Windermere, FL (US);
Edward Paul Martin, Jr., Orlando, FL (US);
Amal MA Hamad, Frisco, TX (US);
William A. Russell, Orlando, FL (US);
Daniel Charles Kerr, Orlando, FL (US);
Alan Sangone Chen, Windermere, FL (US);
Edward Paul Martin, Jr., Orlando, FL (US);
Amal Ma Hamad, Frisco, TX (US);
William A. Russell, Orlando, FL (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity from the device to a substrate of the integrated circuit. In one embodiment a heat sink is affixed to the integrated circuit for heat flow from the integrated circuit. The method comprises forming openings in material layers overlying the semiconductor substrate, wherein the openings are disposed proximate the device and extend to the substrate. A thermally conductive material is formed in the openings to provide a thermal path from the device to the substrate.