The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Nov. 06, 2002
Hiroaki Inoue, Tokyo, JP;
Xinming Wang, Kanagawa, JP;
Moriji Matsumoto, Kanagawa, JP;
Makoto Kanayama, Kanagawa, JP;
Hiroaki Inoue, Tokyo, JP;
Xinming Wang, Kanagawa, JP;
Moriji Matsumoto, Kanagawa, JP;
Makoto Kanayama, Kanagawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to a plating solution useful for forming embedded interconnects by embedding a conductive material in fine recesses for interconnects provided in the surface of a substrate, such as a semiconductor substrate, or for forming a protective layer for protecting the surface of embedded interconnects, a semiconductor device manufactured by using the plating solution and a method for manufacturing the semiconductor device. The plating solution contains copper ions, metal ions of a metal, and the metal is capable of forming with copper a copper alloy in which the metal does not form a solid solution with copper, a complexing agent, and a reducing agent free from alkali metal.