The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
Sep. 22, 2004
Hideyo Osanai, Shiojiri, JP;
Makoto Namioka, Shiojiri, JP;
Susumu Ibaraki, Shiojiri, JP;
Dowa Mining Co., Ltd., , JP;
Abstract
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrateto be cooled and solidified. Thus, a circuit forming metal platehaving a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate, and a metal base plateis bonded to the other side thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile