The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Dec. 15, 2004
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
Applicants:
John Lee Colbert, Byron, MN (US);
Justin Christopher Rogers, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
Inventors:
John Lee Colbert, Byron, MN (US);
Justin Christopher Rogers, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.