The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Mar. 09, 1998
Masaru Takada, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Masaru Takada, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, Gifu-Ken, JP;
Abstract
In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon each other. The first conductive layer () is a parts connecting layer and the n-th conductive layer () is an external connecting layer which is connected to external connecting terminals (). The second to (n−1)-th conductive layers () are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.