The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2008

Filed:

Jun. 22, 2004
Applicants:

Myoung-hwan OH, Yongin-si, KR;

Hee-sung Kang, Sungnam-si, KR;

Chang-hyun Park, Suwon-si, KR;

Inventors:

Myoung-Hwan Oh, Yongin-si, KR;

Hee-Sung Kang, Sungnam-si, KR;

Chang-Hyun Park, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/46 (2006.01); H01L 21/301 (2006.01); H01L 21/76 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method for manufacturing a semiconductor device having an alignment mark, a buffer layer is formed on a substrate. A trench is formed at an isolation region of the substrate. The trench is filled with an insulating layer. An alignment groove is formed on the insulating layer in a scribe lane region of the substrate. The buffer layer is removed to form an alignment pattern. An alignment mark includes the alignment pattern and the alignment groove. Therefore, the alignment pattern may be not attacked by solutions in a successive cleaning process such that the alignment mark may be not damaged and maintains its original shape.


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