The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7338585 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 04, 2008

Filed:

May. 17, 2006
Applicants:

Rohan N. Akolkar, Hillsboro, OR (US);

Valery M. Dubin, Portland, OR (US);

Inventors:

Rohan N. Akolkar, Hillsboro, OR (US);

Valery M. Dubin, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. A method comprising forming an interconnection opening through a dielectric material to a contact point; lining the interconnection opening with a barrier layer and a seed layer; and electroplating an interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine.


Find Patent Forward Citations

Quick Actions:

Akolkar, Rohan. (2008). Electroplating chemistries and methods of forming interconnections (U.S. Patent No. 7338585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7338585

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…