The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2008

Filed:

Mar. 15, 2006
Applicant:

Fang-xiang Yu, Guangdong, CN;

Inventor:

Fang-Xiang Yu, Guangdong, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Longhua Town, Bao'an District, Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipating apparatus () for dissipating heat from a heat-generating electronic component includes a heat sink (), a resilient clipping member (), and an operating member (). The heat sink contacts with the heat-generating electronic component, and includes a fin assembly () which defines a channel () therein. The resilient clipping member is received in the channel of the heat sink for mounting the heat sink on the heat-generating electronic component. The operating member is pivotally mounted to the clipping member. At least one portion of the operating member is mounted between the fin assembly and the clipping member. The at least one portion can move from an unlock position to a lock position to support the clipping member away from the heat-generating electronic component.


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