The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
Jan. 06, 2006
Jeanne S. Pavio, Paradise Valley, AZ (US);
Jeanne S. Pavio, Paradise Valley, AZ (US);
HVVI, Semiconductors, Inc., Phoenix, AZ (US);
Abstract
A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.