The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
Jan. 16, 2007
Applicants:
Jerry Hwang, Hsin-Chu, TW;
Cheng Hsun Chan, Hsin-Chu, TW;
Inventors:
Jerry Hwang, Hsin-Chu, TW;
Cheng Hsun Chan, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 51/00 (2006.01); B24B 1/00 (2006.01); B24B 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media heater connected to the inner tube; and a pressure controller connected to the inner tube.