The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
May. 02, 2006
Ryoichi Kajiwara, Hitachi, JP;
Masahiro Koizumi, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Kazuya Takahashi, Hitachinaka, JP;
Munehisa Kishimoto, Kamakura, JP;
Shigeru Ishii, Tomiya-machi, JP;
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Takasaki, JP;
Toshiyuki Hata, Maebashi, JP;
Hiroshi Sato, Takasaki, JP;
Keiichi Ookawa, Takasaki, JP;
Ryoichi Kajiwara, Hitachi, JP;
Masahiro Koizumi, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Kazuya Takahashi, Hitachinaka, JP;
Munehisa Kishimoto, Kamakura, JP;
Shigeru Ishii, Tomiya-machi, JP;
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Takasaki, JP;
Toshiyuki Hata, Maebashi, JP;
Hiroshi Sato, Takasaki, JP;
Keiichi Ookawa, Takasaki, JP;
Renesas Technology Corp., Tokyo, JP;
Hitachi Tohbu Semiconductor, Ltd., Takasaki-Shi, JP;
Abstract
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.