The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Mar. 21, 2005
Charles Valverde, Ansonia, CT (US);
Nicolai Petrov, Hamden, CT (US);
Eric Yakobson, Aliso Viejo, CA (US);
Qingyun Chen, Branford, CT (US);
Vincent Paneccasio, Jr., Madison, CT (US);
Richard Hurtubise, Clinton, CT (US);
Christian Witt, Woodbridge, CT (US);
Charles Valverde, Ansonia, CT (US);
Nicolai Petrov, Hamden, CT (US);
Eric Yakobson, Aliso Viejo, CA (US);
Qingyun Chen, Branford, CT (US);
Vincent Paneccasio, Jr., Madison, CT (US);
Richard Hurtubise, Clinton, CT (US);
Christian Witt, Woodbridge, CT (US);
Enthone, Inc., West Haven, CT (US);
Abstract
An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.