The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2008

Filed:

Jun. 10, 2004
Applicants:

Satoshi Ohkawara, Tokyo, JP;

Takaaki Inoue, Tokyo, JP;

Inventors:

Satoshi Ohkawara, Tokyo, JP;

Takaaki Inoue, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.


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