The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Oct. 11, 2005
Ulrich Bachmaier, Ruderting, DE;
Michael Bauer, Nittendorf, DE;
Robert-christian Hagen, Sarching, DE;
Jens Pohl, Bernhardswald, DE;
Rainer Steiner, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Hermann Vilsmeier, Regensburg, DE;
Holger Woerner, Regensburg, DE;
Bernhard Zuhr, Regensburg, DE;
Ulrich Bachmaier, Ruderting, DE;
Michael Bauer, Nittendorf, DE;
Robert-Christian Hagen, Sarching, DE;
Jens Pohl, Bernhardswald, DE;
Rainer Steiner, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Hermann Vilsmeier, Regensburg, DE;
Holger Woerner, Regensburg, DE;
Bernhard Zuhr, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.