The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

Jan. 08, 2004
Applicants:

Katsumi Shibayama, Hamamatsu, JP;

Yutaka Kusuyama, Hamamatsu, JP;

Masahiro Hayashi, Hamamatsu, JP;

Inventors:

Katsumi Shibayama, Hamamatsu, JP;

Yutaka Kusuyama, Hamamatsu, JP;

Masahiro Hayashi, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 23/48 (2006.01); G01T 1/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate section, which has a wiring substratewith through holeseach filled with a conductive memberserving as a conduction path for guiding a detected signal, is installed between a radiation detecting sectioncomprised of a scintillatorand a PD array, and a signal processing elementfor processing the detected signals outputted from the PD array. Each through holein the wiring substrateis formed so that, with respect to a predetermined plane perpendicular to a conduction direction from an input surfaceto an output surface, an aperture of the through holein that plane is not on an extension along the conduction direction of an aperture of the through holein the input surfaceand so that the through holecannot be seen through from the input surfaceto the output surface. This obtains the wiring substrate capable of suppressing transmission of radiation, and a radiation detector using it.


Find Patent Forward Citations

Loading…