The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Oct. 28, 2004
Applicant:
Sheng-tsung Liu, Kaohsiung, TW;
Inventor:
Sheng-Tsung Liu, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower surface, disposing a plurality of chips on the upper surfaces of the sub-substrate strips, forming a plurality of encapsulation bodies for encapsulating the chips on the upper surfaces respectively, and forming a plurality of ribs between the encapsulation bodies.
Liu, Sheng-Tsung. (2008). Method for manufacturing ball grid array package (U.S. Patent No. 7326590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7326590
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile