The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Aug. 28, 2002
Michael W. Morrison, Boise, ID (US);
Michael W. Morrison, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape assembly equipment are disclosed. Circuitry-bearing segments having an electrically insulating layer that carries redistribution circuitry and redistributed bond pads and which is supported from beneath by a support layer are secured to the active surface of a semiconductor die. The support layer may comprise an electrically conductive material, which may act as a heat sink or as a ground plane for the packaged semiconductor device. The methods provide increased accuracy with which segments are placed on a semiconductor die relative to the placement accuracies provided when pick-and-place equipment is used to position conventional grid array substrates relative to semiconductor dice.